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ERIC Number: EJ1324901
Record Type: Journal
Publication Date: 2022
Pages: 30
Abstractor: As Provided
ISBN: N/A
ISSN: EISSN-2227-7102
EISSN: N/A
Available Date: N/A
Usefulness of Digital Serious Games in Engineering for Diverse Undergraduate Students
Cook-Chennault, Kimberly; Villanueva Alarcón, Idalis; Jacob, Gabrielle
Education Sciences, v12 Article 27 2022
The use of educational digital games as supplemental tools to course instruction materials has increased over the last several decades and especially since the COVID-19 pandemic. Though these types of instructional games have been employed in the majority of STEM disciplines, less is known about how diverse populations of students interpret and define the value of these games towards achieving academic and professional pursuits. A mixed-method sequential exploratory research design method that was framed on the Technology Acceptance Model, Game-Based Learning Theory and Expectancy Value Theory was used to examine how 201 students perceived the "usefulness" of an intuitive education game that was designed to teach engineering mechanics used in designing civil structures. We found that students had different expectations of educational digital games than games designed for entertainment used outside of classroom environments. Several students thought that the ability to design their own structures and observe structure failure in real-time was a valuable asset in understanding how truss structures responded to physical loading conditions. However, few students thought the educational game would be useful for exam (14/26) or job interview (19/26) preparation. Students associated more value with engineering games that illustrate course content and mathematical calculations used in STEM courses than those that do not include these elements.
MDPI AG. Klybeckstrasse 64, 4057 Basel, Switzerland. e-mail: education@mdpi.com; e-mail: indexing@mdpi.com; Web site: https://www.mdpi.com/journal/education
Publication Type: Journal Articles; Reports - Research
Education Level: Higher Education; Postsecondary Education
Audience: N/A
Language: N/A
Sponsor: National Science Foundation (NSF), Division of Engineering Education and Centers (EEC)
Authoring Institution: N/A
Grant or Contract Numbers: EEC1830812; EEC1830788/2113739
Author Affiliations: N/A